• DocumentCode
    2784176
  • Title

    ESD Testing of Aluminum and Copper Vertical Parallel plate (VPP) Capacitor Structures

  • Author

    Voldman, Steven H. ; Gebreselasie, Ephrem G. ; He, Zhong-Xiang

  • Author_Institution
    IBM Microelectron., Essex Junction, VT
  • fYear
    2007
  • fDate
    15-19 April 2007
  • Firstpage
    586
  • Lastpage
    587
  • Abstract
    Vertical parallel plate (VPP) capacitor elements are being used in RF components for RF CMOS and RF BiCMOS technologies. ESD robustness evaluation of the VPP capacitor is very important for RF applications when these elements are used on the input pads of RF receiver networks. In this paper, the first ESD measurements of VPP structures are shown for the first time. The purpose of the work is to evaluate the electrical response of the VPP structure for HBM, and transmission line pulse (TLP) waveforms. In addition, new discoveries are disclosed with aluminum and copper vertical parallel plate capacitor elements.
  • Keywords
    aluminium; capacitors; copper; electron device testing; electrostatic discharge; Al; Cu; ESD measurements; ESD testing; aluminum vertical parallel plate capacitor structures; copper vertical parallel plate capacitor structures; transmission line pulse waveforms; Aluminum; BiCMOS integrated circuits; CMOS technology; Capacitors; Copper; Electrostatic discharge; Radio frequency; Robustness; Testing; Transmission line measurements; Electrostatic discharge (ESD); Transmission Line Pulse (TLP); Vertical Parallel Plate (VPP) capacitors; Very Fast Transmission Line Pulse (VF-TLP);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    1-4244-0919-5
  • Electronic_ISBN
    1-4244-0919-5
  • Type

    conf

  • DOI
    10.1109/RELPHY.2007.369963
  • Filename
    4227704