DocumentCode
2784431
Title
Failure Analysis and Optimization of Metal Fuses for Post Package Trimming
Author
Cheng, Yu-Hsing ; Kendrick, Christian E.
Author_Institution
Analog Technol. Dev., ON Semicond., East Greenwich, RI
fYear
2007
fDate
15-19 April 2007
Firstpage
616
Lastpage
617
Abstract
Post package trimming is important in achieving precise control of circuit parameters that may shift due to package stresses. However, the size of on-chip driver circuitry must be minimized while still maintaining reliably trimmed fuses. This study presents a statistical analysis and physical characterization of trimmed fuses to optimize fuse geometry and trimming conditions.
Keywords
failure analysis; integrated circuit packaging; statistical analysis; failure analysis; metal fuses; on-chip driver circuitry; post package trimming; statistical analysis; Aggregates; Circuit testing; Driver circuits; Electric resistance; Failure analysis; Fuses; Geometry; Pulse circuits; Semiconductor device packaging; Space vector pulse width modulation; Metal fuse; post package trimming;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location
Phoenix, AZ
Print_ISBN
1-4244-0919-5
Electronic_ISBN
1-4244-0919-5
Type
conf
DOI
10.1109/RELPHY.2007.369978
Filename
4227719
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