DocumentCode
2784605
Title
Characterization of Electromigration Parameters on Single Device
Author
Doyen, L. ; Federspiel, X. ; Ney, D. ; Petitprez, E. ; Girault, V. ; Arnaud, L. ; Wouters, Y.
fYear
2007
fDate
15-19 April 2007
Firstpage
636
Lastpage
637
Abstract
The careful analysis of resistance evolution with time during electromigration tests provided valuable information about damascene architecture and intrinsic electromigration behavior. On one hand, void length and barrier resistivity can be extracted from the step height, but we have shown that it is sensitive to high accelerated tests. On the other hand, both the activation energy and the current density exponent can be calculated directly from the slope of the progressive increase, on a single device. Such methodology is likely to increase accuracy on Black´s parameters.
Keywords
current density; electromigration; voids (solid); activation energy; barrier resistivity; current density exponent; damascene architecture; electromigration parameters; electromigration tests; intrinsic electromigration behavior; void length; Conductivity; Current density; Data mining; Electric resistance; Electromigration; Equations; Life testing; Research and development; Semiconductor device testing; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location
Phoenix, AZ
Print_ISBN
1-4244-0919-5
Electronic_ISBN
1-4244-0919-5
Type
conf
DOI
10.1109/RELPHY.2007.369988
Filename
4227729
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