• DocumentCode
    2784605
  • Title

    Characterization of Electromigration Parameters on Single Device

  • Author

    Doyen, L. ; Federspiel, X. ; Ney, D. ; Petitprez, E. ; Girault, V. ; Arnaud, L. ; Wouters, Y.

  • fYear
    2007
  • fDate
    15-19 April 2007
  • Firstpage
    636
  • Lastpage
    637
  • Abstract
    The careful analysis of resistance evolution with time during electromigration tests provided valuable information about damascene architecture and intrinsic electromigration behavior. On one hand, void length and barrier resistivity can be extracted from the step height, but we have shown that it is sensitive to high accelerated tests. On the other hand, both the activation energy and the current density exponent can be calculated directly from the slope of the progressive increase, on a single device. Such methodology is likely to increase accuracy on Black´s parameters.
  • Keywords
    current density; electromigration; voids (solid); activation energy; barrier resistivity; current density exponent; damascene architecture; electromigration parameters; electromigration tests; intrinsic electromigration behavior; void length; Conductivity; Current density; Data mining; Electric resistance; Electromigration; Equations; Life testing; Research and development; Semiconductor device testing; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    1-4244-0919-5
  • Electronic_ISBN
    1-4244-0919-5
  • Type

    conf

  • DOI
    10.1109/RELPHY.2007.369988
  • Filename
    4227729