2785095

Comparison of multichip module technologies for the electronic packaging-of high clock digital signal processors

Gilbert, Barry K. ; Schwab, Daniel J. ; Randall, Barbara M. ; Thompson, Rick L. ; Hakes, Rick J. ; Mielke, Lloyd O. ; Schaefer, Timothy M. ; Zabinski, Patrick J. ; Walters, Wayne L.

Mayo Foundation

1994

1994

Circuit testing; Clocks; Electronic equipment testing; Electronics packaging; Fabrication; Gallium arsenide; Integrated circuit packaging; Multichip modules; Noise level; Semiconductor device packaging;

English

ieee

MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on

conf

10.1109/WPTMT.1994.763516

763516