• DocumentCode
    2785135
  • Title

    Si-on-Si MCMs As a low cost packaging solution

  • Author

    Kusaka, Teruo ; Senba, Naoji ; Nishizawa, Atsushi ; Takahashi, Nobuaki

  • Author_Institution
    NEC Corporation
  • fYear
    1994
  • fDate
    1994
  • Keywords
    Chip scale packaging; Costs; Integrated circuit interconnections; Laboratories; Large scale integration; National electric code; Research and development; Semiconductor device packaging; Substrates; Systems engineering and theory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
  • Type

    conf

  • DOI
    10.1109/WPTMT.1994.763518
  • Filename
    763518
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2785135