2785135

Si-on-Si MCMs As a low cost packaging solution

Kusaka, Teruo ; Senba, Naoji ; Nishizawa, Atsushi ; Takahashi, Nobuaki

NEC Corporation

1994

1994

Chip scale packaging; Costs; Integrated circuit interconnections; Laboratories; Large scale integration; National electric code; Research and development; Semiconductor device packaging; Substrates; Systems engineering and theory;

English

ieee

MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on

conf

10.1109/WPTMT.1994.763518

763518