Title :
MCM´-Ls: designing versatility and low cost
Author :
Chandler ; Tyler, S.G.
Author_Institution :
GEC-Marconi Research Centre
Keywords :
Cost function; Glass; Lead; Nonhomogeneous media; Packaging; Paper technology; Pins; Soldering; Surface-mount technology; Thermal stresses;
Conference_Titel :
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
DOI :
10.1109/WPTMT.1994.763521
