DocumentCode
2785208
Title
Development of a fluropolymer board technology
Author
Stafford, John W.
Author_Institution
Motorola, Inc.
fYear
1994
fDate
1994
Keywords
Assembly; Circuit testing; Costs; Degradation; Dielectric constant; Dielectric losses; Dielectric substrates; Integrated circuit interconnections; Semiconductor device packaging; Wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
Type
conf
DOI
10.1109/WPTMT.1994.763522
Filename
763522
Link To Document