Title :
Development of a fluropolymer board technology
Author :
Stafford, John W.
Author_Institution :
Motorola, Inc.
Keywords :
Assembly; Circuit testing; Costs; Degradation; Dielectric constant; Dielectric losses; Dielectric substrates; Integrated circuit interconnections; Semiconductor device packaging; Wireless communication;
Conference_Titel :
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
DOI :
10.1109/WPTMT.1994.763522
