DocumentCode
2785246
Title
High frequency properties of ceramic multilayer structures
Author
Bihler, Eckardt ; Exner, Michael ; Thust, Klaus-Heiko ; Müller, Jens
Author_Institution
IBM Deutschland
fYear
1994
fDate
1994
Keywords
Analytical models; Ceramics; Circuit testing; Coupling circuits; Frequency; Integrated circuit interconnections; Microelectronics; Nonhomogeneous media; Semiconductor device packaging; System performance;
fLanguage
English
Publisher
ieee
Conference_Titel
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
Type
conf
DOI
10.1109/WPTMT.1994.763524
Filename
763524
Link To Document