Title :
An investigation into the technology of automatic probing of the international nodes of multichip modules
Author :
Posse, Ken ; Booth, George
Author_Institution :
Hewlett Packard Company
Keywords :
Circuit testing; Costs; Manufacturing; Multichip modules; Packaging; Printed circuits; Probes; Production; Springs;
Conference_Titel :
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
DOI :
10.1109/WPTMT.1994.763526
