Title :
Iterative direct solution method for thermal analysis of electronic equipment
Keywords :
Boundary conditions; Electronic equipment; Geometry; Infrared sensors; Iterative methods; Laplace equations; Laser modes; Performance analysis; Temperature distribution; Temperature measurement;
Conference_Titel :
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
DOI :
10.1109/WPTMT.1994.763527