DocumentCode

2785313

Title

MCM standard packaging for thermal performance

Author

Barrett, Fred W.

Author_Institution

Motorola Commercial Plus Technologies Operation

fYear

1994

fDate

1994

Keywords

Finite element methods; Packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on

Type

conf

DOI

10.1109/WPTMT.1994.763528

Filename

763528