DocumentCode
2785355
Title
Cooling of multi chip module by the use of two-phase flow in liquid channels
Author
Kristiansen, H. ; Gulliksen, M. ; Buran, T. ; Bjorneklett, A.
Author_Institution
SINTEF SI
fYear
1994
fDate
1994
Keywords
Cooling; Detectors; Diodes; Fluid flow; Heat transfer; Microstrip; Silicon; Surface treatment; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
Type
conf
DOI
10.1109/WPTMT.1994.763529
Filename
763529
Link To Document