• DocumentCode
    2785370
  • Title

    Accurate prediction of PQFP warpage

  • Author

    Kelly, G. ; Lyden, C. ; Lawton, W. ; Barrett, J. ; Saboni, A. ; Exposito, J. ; Lamourelle, F.

  • Author_Institution
    University College
  • fYear
    1994
  • fDate
    1994
  • Keywords
    Adhesives; Chemicals; Conducting materials; Electronic packaging thermal management; Encapsulation; Mechanical factors; Plastic packaging; Power measurement; Stress; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
  • Type

    conf

  • DOI
    10.1109/WPTMT.1994.763530
  • Filename
    763530
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2785370