DocumentCode

2785383

Title

"Package cracking and delamination susceptibility of thin small outline packages (TSOP)"

Author

Knab, Hubert ; Gruber, Juergen

Author_Institution

Alcatel SEL

fYear

1994

fDate

1994

Keywords

Assembly; Corrosion; Delamination; Humidity; Lead; Packaging; Plastics; Printed circuits; Reflow soldering; Surface cracks;

fLanguage

English

Publisher

ieee

Conference_Titel

MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on

Type

conf

DOI

10.1109/WPTMT.1994.763531

Filename

763531