Title :
"Package cracking and delamination susceptibility of thin small outline packages (TSOP)"
Author :
Knab, Hubert ; Gruber, Juergen
Author_Institution :
Alcatel SEL
Keywords :
Assembly; Corrosion; Delamination; Humidity; Lead; Packaging; Plastics; Printed circuits; Reflow soldering; Surface cracks;
Conference_Titel :
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
DOI :
10.1109/WPTMT.1994.763531
