Title :
Non-hermetic techniques for low cost, high performance, opto-electronic component assembly
Author_Institution :
BT Labs
Keywords :
Assembly; Costs; Degradation; Fiber lasers; Optical fibers; Packaging; Photodiodes; Semiconductor lasers; Stress; Testing;
Conference_Titel :
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
DOI :
10.1109/WPTMT.1994.763536
