Title :
Tab with bumpless chips
Author :
DEHAINE, Gérard ; COURANT, Patrick
Author_Institution :
Bull S.A.
Keywords :
Circuits; Coatings; Error correction; Gold; Manufacturing; Thickness control; Very large scale integration; Wafer bonding; Wire;
Conference_Titel :
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
DOI :
10.1109/WPTMT.1994.763537
