Title :
Alternative metallization by low cost electroless plating for MCM applications
Author :
Ostmann, A. ; Aschenbrenner, R. ; Beutler, U. ; Reichl, H.
Author_Institution :
Technical University of Berlin
Keywords :
Adhesives; Aluminum; Bonding processes; Copper; Costs; Integrated circuit interconnections; Metallization; Nickel; Packaging; Tin;
Conference_Titel :
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
DOI :
10.1109/WPTMT.1994.763538
