DocumentCode
2785639
Title
Characterisation and reliability evaluation of a verticle multichip module (NCM-TV) technique using test chips
Author
Barrett, John ; Cahill, C. ; Compagno, T. ; Flaherty, Martin O. ; Hayes, T. ; Lawton, W. ; Donavan, J.O. ; McCarthy, G. ; Slattery, O. ; Waldron, F. ; Vera, A. Coella ; Masgrangeas, M. ; Val, C. ; Drouhin, I.
Author_Institution
University College Cork
fYear
1994
fDate
1994
Keywords
Corrosion; Microelectronics; Multichip modules; Plastics; Resistors; Semiconductor device measurement; Strain measurement; Testing; Thermal stresses; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
Type
conf
DOI
10.1109/WPTMT.1994.763544
Filename
763544
Link To Document