Tailoring thermal profiles for the reflow of SMD assemblies

Author

Tang, A.C.T. ; Whalley, D.C. ; Williams, D.J.

Author_Institution

Dept. of Eng., Cambridge Univ., UK

fYear

1990

fDate

1-3 Oct 1990

Firstpage

77

Lastpage

81

Abstract

The aim is to investigate the effects of various types of thermal components (also known as heat thieves/barriers) on the thermal profiles of a printed circuit board (PCB). It is demonstrated that it is practical to apply modeling techniques to the IR reflow soldering process. Results show that the thermal profiles of the PCB can be tailored. This is achieved by surrounding the PCB with different materials, such as copper, alumina, and graphite, in a strip or ring formation. This has the effect of altering the distribution of the thermal properties of the system. Results obtained using the model show that by attaching an alumina strip to the outer edge of the PCB can reduce the temperature differential of the PCB to less than 5°C

Keywords

modelling; printed circuit design; soldering; surface mount technology; temperature distribution; thermal analysis; Al₂O₃; IR reflow soldering process; PCB; SMD assemblies; SMT; alumina strip; modeling techniques; printed circuit board; thermal components; thermal profiles; Assembly; Geometry; Heat transfer; Heating; Joining processes; Manufacturing processes; Production; Reflow soldering; Strips; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1990 Proceedings, Competitive Manufacturing for the Next Decade. IEMT Symposium, Ninth IEEE/CHMT International

Conference_Location

Washington, DC

Type

conf

DOI

10.1109/IEMT9.1990.114984

Filename

114984