Title :
Board level reliability of tin-lead plated and hot solder coated lead finishes as a function of solderability
Author :
Pope, D.E. ; Vanderziel, K.
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
The board-level solder joint reliability of plastic surface-mount components was evaluated by temperature cycling plastic leaded chip carrier (PLCC) and plastic quad flatpack (PQFP) components. Reliability was assessed by using T/C `C´ (-65°C to +150°C for a 30-min period) conditions. Acceptable reliability was obtained for all components which met current solderability requirements. Only solderability specimens which would have failed standard visual inspection exhibited unacceptable levels of cracking after exposure to T/C `C´ conditions. Both 85%-tin-15%-lead solder plated finish and 63%-tin-37%-lead hot solder coated components are evaluated
Keywords :
circuit reliability; printed circuit manufacture; soldering; -65 to 150 degC; PLCC; PQFP; Sn-Pb plated leads; SnPb; board level reliability; chip carrier; hot solder coated; lead finishes; plastic surface-mount components; quad flatpack; solder joint reliability; solderability; temperature cycling; Aging; Inspection; Lead; Packaging; Plastics; Sliding mode control; Soldering; Surface-mount technology; Temperature; Testing;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1990 Proceedings, Competitive Manufacturing for the Next Decade. IEMT Symposium, Ninth IEEE/CHMT International
Conference_Location :
Washington, DC
DOI :
10.1109/IEMT9.1990.114986
