Board level reliability of tin-lead plated and hot solder coated lead finishes as a function of solderability

Author

Pope, D.E. ; Vanderziel, K.

Author_Institution

Intel Corp., Chandler, AZ, USA

fYear

1990

fDate

1-3 Oct 1990

Firstpage

83

Lastpage

91

Abstract

The board-level solder joint reliability of plastic surface-mount components was evaluated by temperature cycling plastic leaded chip carrier (PLCC) and plastic quad flatpack (PQFP) components. Reliability was assessed by using T/C `C´ (-65°C to +150°C for a 30-min period) conditions. Acceptable reliability was obtained for all components which met current solderability requirements. Only solderability specimens which would have failed standard visual inspection exhibited unacceptable levels of cracking after exposure to T/C `C´ conditions. Both 85%-tin-15%-lead solder plated finish and 63%-tin-37%-lead hot solder coated components are evaluated

Keywords

circuit reliability; printed circuit manufacture; soldering; -65 to 150 degC; PLCC; PQFP; Sn-Pb plated leads; SnPb; board level reliability; chip carrier; hot solder coated; lead finishes; plastic surface-mount components; quad flatpack; solder joint reliability; solderability; temperature cycling; Aging; Inspection; Lead; Packaging; Plastics; Sliding mode control; Soldering; Surface-mount technology; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1990 Proceedings, Competitive Manufacturing for the Next Decade. IEMT Symposium, Ninth IEEE/CHMT International

Conference_Location

Washington, DC

Type

conf

DOI

10.1109/IEMT9.1990.114986

Filename

114986