Title :
A 3-D WASP module for real-time signal and data processing
Author_Institution :
Aspex Microsystems Ltd., Uxbridge, UK
Abstract :
Progress to data has concentrated on the integration of 8192 processors on a single silicon wafer (viz., a 2-D WASP (Wafer Scale Integration Associative String Processor) device). The author considers the migration of the design concept to 3-D WASP wafer stacks. A 3-D WASP architecture is described and compared with its 2-D WASP predecessor. Benefits in size, weight, power, reliability, and cost are discussed, and cost-effectiveness figures-of-merit on the order of 100 tera-OPS/ft 3, 100 tera-OPS/lb, 1 giga-OPS/W, and 10 mega-OPS/$ are forecast
Keywords :
VLSI; digital signal processing chips; microprocessor chips; parallel architectures; parallel machines; real-time systems; 3-D WASP architecture; 3-D WASP module; 3-D WASP wafer stacks; WSI Associative String Processor; cost-effectiveness figures-of-merit; real-time data processing; real-time signal processing; wafer scale integration; Aerospace industry; Artificial intelligence; Concurrent computing; Costs; Data processing; Electromagnetic radiation; Fault tolerance; Radar signal processing; Radar tracking; Signal processing;
Conference_Titel :
Wafer Scale Integration, 1992. Proceedings., [4th] International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-8186-2482-5
DOI :
10.1109/ICWSI.1992.171800
