Title :
Repairing power shorts in WSI circuits using infra-red imaging and laser cutting
Author :
Yung, Michael W.
Author_Institution :
Hughes Res. Lab., Malibu, CA, USA
Abstract :
An efficient approach to implement a defect tolerant power distribution network suitable for WSI (wafer scale integration) circuits was proposed by M. W. Yung and M. J. Little (1991). The design of the power distribution network has been incorporated into the wafer-scale circuit wafers designed for Hughes 3-D Computer. Experimental results from test structures and practical experience in locating and repairing power shorts on these wafers are discussed
Keywords :
VLSI; infrared imaging; laser beam machining; metallisation; IR imaging; WSI circuits; defect tolerant power distribution network; infra-red imaging; laser cutting; power shorts location; power shorts repair; practical experience; test structures; thermography; wafer scale integration; wafer-scale circuit wafers; Circuit testing; Computer networks; Fabrication; Infrared imaging; Intelligent networks; Laboratories; Laser beam cutting; Power lasers; Power systems; Wafer scale integration;
Conference_Titel :
Wafer Scale Integration, 1992. Proceedings., [4th] International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-8186-2482-5
DOI :
10.1109/ICWSI.1992.171807
