• DocumentCode
    2789230
  • Title

    Integration of antenna elements onto semiconductor substrates for use in phased arrays

  • Author

    Rock, Janice C.

  • Author_Institution
    U.S. Army Aviation & Missile Res., Dev., & Eng. Center, Huntsville, AL, USA
  • fYear
    2005
  • fDate
    5-12 March 2005
  • Firstpage
    1124
  • Lastpage
    1130
  • Abstract
    This paper discusses the ongoing research being conducted in the RF Technology Division of the Applied Sensors, Guidance, and Electronics Directorate, US Army Aviation and Missile Research, Development, and Engineering Center (AMRDEC) on the Redstone Arsenal in Huntsville, Alabama. The overall purpose of the research is to determine and overcome the technological barriers impinging upon enhancements to current phased array technology which is expected to include MEMS in addition to chip-level integration of multiple phased array components. An overview of phased array systems and components is presented along with applications and insertion into potential military systems and the benefits thereof. The paper discusses the current research effort and future research areas for this project and its benefits in creating an air defense system to support the Future Combat System (FCS) of the US Army.
  • Keywords
    antenna phased arrays; micromechanical devices; military systems; Future Combat System; MEMS; US Army; air defense system; chip-level integration; military systems; phased array systems; semiconductor substrates; Antenna accessories; Antenna arrays; Electromagnetic radiation; Fabrication; Missiles; Phased arrays; Semiconductor device packaging; Substrates; Switches; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace Conference, 2005 IEEE
  • Conference_Location
    Big Sky, MT
  • Print_ISBN
    0-7803-8870-4
  • Type

    conf

  • DOI
    10.1109/AERO.2005.1559403
  • Filename
    1559403