DocumentCode :
2789230
Title :
Integration of antenna elements onto semiconductor substrates for use in phased arrays
Author :
Rock, Janice C.
Author_Institution :
U.S. Army Aviation & Missile Res., Dev., & Eng. Center, Huntsville, AL, USA
fYear :
2005
fDate :
5-12 March 2005
Firstpage :
1124
Lastpage :
1130
Abstract :
This paper discusses the ongoing research being conducted in the RF Technology Division of the Applied Sensors, Guidance, and Electronics Directorate, US Army Aviation and Missile Research, Development, and Engineering Center (AMRDEC) on the Redstone Arsenal in Huntsville, Alabama. The overall purpose of the research is to determine and overcome the technological barriers impinging upon enhancements to current phased array technology which is expected to include MEMS in addition to chip-level integration of multiple phased array components. An overview of phased array systems and components is presented along with applications and insertion into potential military systems and the benefits thereof. The paper discusses the current research effort and future research areas for this project and its benefits in creating an air defense system to support the Future Combat System (FCS) of the US Army.
Keywords :
antenna phased arrays; micromechanical devices; military systems; Future Combat System; MEMS; US Army; air defense system; chip-level integration; military systems; phased array systems; semiconductor substrates; Antenna accessories; Antenna arrays; Electromagnetic radiation; Fabrication; Missiles; Phased arrays; Semiconductor device packaging; Substrates; Switches; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Aerospace Conference, 2005 IEEE
Conference_Location :
Big Sky, MT
Print_ISBN :
0-7803-8870-4
Type :
conf
DOI :
10.1109/AERO.2005.1559403
Filename :
1559403
Link To Document :
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