DocumentCode
2790902
Title
Challenges in physical chip design
Author
Otten, R.H.J.M. ; Stravers, P.
Author_Institution
Eindhoven Univ. of Technol., Netherlands
fYear
2000
fDate
5-9 Nov. 2000
Firstpage
84
Lastpage
91
Abstract
Chip industry obeys a number of laws, various kinds of laws. Mathematical laws if accurate models can be formulated, physical laws, especially solid state physics, obtained by observation and induction, chemical laws pertinent for the manufacturing processes, economical and judicial laws that concern such industries. These laws still hold true, although technology has come a long way since they were formulated. Obviously, modern technologies require a completely different design flow. Homogeneous processors do not benefit much from parts of a traditional flow. The emphasis should be more on modeling applications as networks of communicating processes in a suitable specification language. Equally important is reuse of specification software, considering the short life spans of integrated circuits and the demand for short paths to the market. General multilayer designs require complete new layout synthesis tools. Placement is obsolete and even floorplan design for each layer is not adequate because of the strong geometrical constraints. Wire planning will be more of a must, but has to acquire a more precise meaning in this application. The challenges posed by the unavoidable escape routes, to break free from the confinements of conventional large scale integration methodologies, is the topic of this paper.
Keywords
circuit CAD; integrated circuit design; technological forecasting; Wire planning; chip design; design flow; floorplan design; homogeneous processors; multilayer designs; reuse of specification software; Chemical industry; Chemical processes; Chemical technology; Chip scale packaging; Manufacturing industries; Manufacturing processes; Mathematical model; Physics; Solid modeling; Solid state circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Aided Design, 2000. ICCAD-2000. IEEE/ACM International Conference on
Conference_Location
San Jose, CA, USA
ISSN
1092-3152
Print_ISBN
0-7803-6445-7
Type
conf
DOI
10.1109/ICCAD.2000.896455
Filename
896455
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