• DocumentCode
    2791638
  • Title

    Micro Processing a Path to Aggressive Instrument Miniaturization for Micro and Picosats

  • Author

    Wesolek, Danielle M. ; Darrin, Ann Garrison ; Osiander, Robert ; Lehtonen, S. John ; Edwards, Richard L. ; Hererro, Fred A.

  • Author_Institution
    Appl. Phys. Lab., Johns Hopkins Univ., Laurel, MD
  • fYear
    2005
  • fDate
    5-12 March 2005
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    Advanced micro-fabrication and packaging techniques provided through microelectromechanical systems (MEMS) technology enable fabrication and system integration of a miniature flat plasma spectrometer (FlaPS) capable of making fine resolution measurements of the kinetic energy spectra and angular distributions of ions in a space environment. This instrument demonstration flies on USAFA Falconsat-3 and represents a demonstration of how advanced fabrication techniques for the microprocessing world can be utilized to derive aggressive miniaturization. High performance metrics in terms of sensitivity and resolution are achievable with significant reductions in mass and power compared to conventional spectrometers. A FlaPS instrument, including sensor-head array, printed circuit board with amplifier array electronics, power supply, and chassis has been designed and built to occupy a volume of approximately 200 cm3 in a 0.5kg, 300mW package. This technique could easily be migrated to other instruments and in the future potentially to subsystems
  • Keywords
    micromechanical devices; spectrometers; 300 mW; FlaPS instrument; MEMS technology; amplifier array electronics; angular distributions; flat plasma spectrometer; instrument miniaturization; kinetic energy spectra; micro processing techniques; micro-fabrication techniques; microelectromechanical systems; packaging techniques; power supply; printed circuit board; sensor-head array; Energy resolution; Fabrication; Instruments; Microelectromechanical systems; Micromechanical devices; Packaging; Plasma applications; Plasma measurements; Sensor arrays; Space technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace Conference, 2005 IEEE
  • Conference_Location
    Big Sky, MT
  • Print_ISBN
    0-7803-8870-4
  • Type

    conf

  • DOI
    10.1109/AERO.2005.1559555
  • Filename
    1559555