DocumentCode
2792429
Title
Phase-field simulations of non-isothermal binary alloys solidification with Neumann boundary conditions
Author
Qiang, Liu ; Xiang-Jie, Yang ; Zhi-Ling, Liu
Author_Institution
Sch. of Mechatron. Eng., Nanchang Univ., Nanchang, China
fYear
2011
fDate
15-17 July 2011
Firstpage
517
Lastpage
520
Abstract
The dendrite growth process during the non isothermal solidification of the Al-4.5%Cu binary alloy was simulated by using the phase-field model with the Neumann boundary conditions. Solute diffusion equation and heat transfer equation were solved simultaneously. The dendrite growth, solute and temperature profile in the non-isothermal solidification were investigated. The results indicate that the simulation with Neumann boundary conditions agree well with the features commonly observed in real solidification of binary alloy.The tip speed decreased and the tip radius increases at first. Then both of the tip speed and radius become larger. Finally the tip speed and radius reduce gradually over time, the solute gradients exist in the interface before the dendrite tip is the highest. The temperature in non-isothermal solidification decreases at first and then gradually increase.
Keywords
aluminium alloys; copper alloys; dendrites; diffusion; heat transfer; solidification; AlCu; Neumann boundary conditions; dendrite growth process; heat transfer equation; nonisothermal binary alloy solidification; phase-field simulations; solute diffusion equation; solute gradients; Boundary conditions; Equations; Heating; Mathematical model; Metals; Solid modeling; Solids; Neumann boundary conditions; dendrite growth; non-isothermal; phase-field model;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechanic Automation and Control Engineering (MACE), 2011 Second International Conference on
Conference_Location
Hohhot
Print_ISBN
978-1-4244-9436-1
Type
conf
DOI
10.1109/MACE.2011.5986974
Filename
5986974
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