DocumentCode
2793303
Title
Electrical performance of triple implanted vertical silicon carbide MOSFETs with low on-resistance
Author
Peters, Dethard ; Friedrichs, Peter ; Schorner, Reinhold ; Mitlehner, Heinz ; Weis, Benno ; Stephani, Dietrich
Author_Institution
Corp. Technol., Siemens AG, Erlangen, Germany
fYear
1999
fDate
1999
Firstpage
103
Lastpage
106
Abstract
This paper describes results of 6H silicon carbide vertical power MOSFETs designed for different blocking capabilities: 600 V and 1600 V. The fabrication is based on a triple implantation technique with a lateral inversion channel. The MOSFETs are normally off and exhibit specific on-resistances of 22 and 40 mΩcm2, respectively. A chip area of 1 mm2 has emerged as a suitable value in order to achieve an acceptable yield with respect to the blocking capability. A SiC MOSFET of this size can be driven up to 1 A in continuous operation. As expected for a unipolar device, short turn-on and turn-off delay times have been measured. In particular, due to a very small accumulation zone, the Miller capacitance is small in comparison to Si MOSFETs. The switching speed can be influenced by the gate driving circuit in a wide range. The SiC MOSFET is controllable in all switching states and stable up to 125°C case temperature. The switching behaviour tested under conditions typical for motor drives is robust against short cuts and short time overloading
Keywords
capacitance; capacitor switching; delays; electric resistance; ion implantation; motor drives; power MOSFET; silicon compounds; thermal stability; wide band gap semiconductors; 1 A; 125 C; 1600 V; 600 V; 6H silicon carbide vertical power MOSFETs; MOSFETs; Miller capacitance; SiC; SiC MOSFET; SiC MOSFET yield; accumulation zone; blocking capability; chip area; electrical performance; gate driving circuit; lateral inversion channel; motor drives; on-resistance; short cuts; short time overloading; specific on-resistance; switching behaviour; switching speed; switching states; temperature stability; triple implantation technique; triple implanted vertical silicon carbide MOSFETs; turn-off delay time; turn-on delay time; unipolar device; Capacitance; Circuit testing; Delay; Fabrication; MOSFETs; Motor drives; Robustness; Silicon carbide; Switching circuits; Temperature control;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs, 1999. ISPSD '99. Proceedings., The 11th International Symposium on
Conference_Location
Toronto, Ont.
ISSN
1063-6854
Print_ISBN
0-7803-5290-4
Type
conf
DOI
10.1109/ISPSD.1999.764071
Filename
764071
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