• DocumentCode
    2793303
  • Title

    Electrical performance of triple implanted vertical silicon carbide MOSFETs with low on-resistance

  • Author

    Peters, Dethard ; Friedrichs, Peter ; Schorner, Reinhold ; Mitlehner, Heinz ; Weis, Benno ; Stephani, Dietrich

  • Author_Institution
    Corp. Technol., Siemens AG, Erlangen, Germany
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    103
  • Lastpage
    106
  • Abstract
    This paper describes results of 6H silicon carbide vertical power MOSFETs designed for different blocking capabilities: 600 V and 1600 V. The fabrication is based on a triple implantation technique with a lateral inversion channel. The MOSFETs are normally off and exhibit specific on-resistances of 22 and 40 mΩcm2, respectively. A chip area of 1 mm2 has emerged as a suitable value in order to achieve an acceptable yield with respect to the blocking capability. A SiC MOSFET of this size can be driven up to 1 A in continuous operation. As expected for a unipolar device, short turn-on and turn-off delay times have been measured. In particular, due to a very small accumulation zone, the Miller capacitance is small in comparison to Si MOSFETs. The switching speed can be influenced by the gate driving circuit in a wide range. The SiC MOSFET is controllable in all switching states and stable up to 125°C case temperature. The switching behaviour tested under conditions typical for motor drives is robust against short cuts and short time overloading
  • Keywords
    capacitance; capacitor switching; delays; electric resistance; ion implantation; motor drives; power MOSFET; silicon compounds; thermal stability; wide band gap semiconductors; 1 A; 125 C; 1600 V; 600 V; 6H silicon carbide vertical power MOSFETs; MOSFETs; Miller capacitance; SiC; SiC MOSFET; SiC MOSFET yield; accumulation zone; blocking capability; chip area; electrical performance; gate driving circuit; lateral inversion channel; motor drives; on-resistance; short cuts; short time overloading; specific on-resistance; switching behaviour; switching speed; switching states; temperature stability; triple implantation technique; triple implanted vertical silicon carbide MOSFETs; turn-off delay time; turn-on delay time; unipolar device; Capacitance; Circuit testing; Delay; Fabrication; MOSFETs; Motor drives; Robustness; Silicon carbide; Switching circuits; Temperature control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs, 1999. ISPSD '99. Proceedings., The 11th International Symposium on
  • Conference_Location
    Toronto, Ont.
  • ISSN
    1063-6854
  • Print_ISBN
    0-7803-5290-4
  • Type

    conf

  • DOI
    10.1109/ISPSD.1999.764071
  • Filename
    764071