Development of a mold resin for molded transformers and its mechanical and insulating characteristics

Author

Fukushi, K. ; Takasaki, H. ; Koyama, T. ; Fujimori, T.

Author_Institution

Hitachi Ltd., Ibaraki, Japan

fYear

1991

fDate

8-12 Jul 1991

Firstpage

452

Abstract

To obtain a low-thermal-expansion mold resin, various tests to obtain the most suitable coupling agent for the resin were carried out. As a result, the mixture of titanate and silane type coupling agents allowed an increase in filler content to higher than 60% in volume. The developed mold resin showed a thermal expansion coefficient as low as that of aluminum and had excellent resistance to cracking. Finally, it was confirmed that the mechanical strength, dielectric strength, and E-t characteristics of the developed resin were superior to those of the conventional one

Keywords

electric breakdown of solids; electric strength; mechanical strength; organic insulating materials; power transformers; thermal expansion; transformer insulation; E-t characteristics; coupling agent; crack resistance; dielectric strength; filler content; insulating characteristics; low-thermal-expansion; mechanical strength; mold resin; molded transformers; silane type coupling agents; thermal expansion coefficient; titanate type coupling agent; Aluminum; Conductors; Epoxy resins; Power transformer insulation; Temperature; Testing; Thermal conductivity; Thermal expansion; Titanium compounds; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Properties and Applications of Dielectric Materials, 1991., Proceedings of the 3rd International Conference on

Conference_Location

Tokyo

Print_ISBN

0-87942-568-7

Type

conf

DOI

10.1109/ICPADM.1991.172094

Filename

172094