Title :
Development of a mold resin for molded transformers and its mechanical and insulating characteristics
Author :
Fukushi, K. ; Takasaki, H. ; Koyama, T. ; Fujimori, T.
Author_Institution :
Hitachi Ltd., Ibaraki, Japan
Abstract :
To obtain a low-thermal-expansion mold resin, various tests to obtain the most suitable coupling agent for the resin were carried out. As a result, the mixture of titanate and silane type coupling agents allowed an increase in filler content to higher than 60% in volume. The developed mold resin showed a thermal expansion coefficient as low as that of aluminum and had excellent resistance to cracking. Finally, it was confirmed that the mechanical strength, dielectric strength, and E-t characteristics of the developed resin were superior to those of the conventional one
Keywords :
electric breakdown of solids; electric strength; mechanical strength; organic insulating materials; power transformers; thermal expansion; transformer insulation; E-t characteristics; coupling agent; crack resistance; dielectric strength; filler content; insulating characteristics; low-thermal-expansion; mechanical strength; mold resin; molded transformers; silane type coupling agents; thermal expansion coefficient; titanate type coupling agent; Aluminum; Conductors; Epoxy resins; Power transformer insulation; Temperature; Testing; Thermal conductivity; Thermal expansion; Titanium compounds; Viscosity;
Conference_Titel :
Properties and Applications of Dielectric Materials, 1991., Proceedings of the 3rd International Conference on
Conference_Location :
Tokyo
Print_ISBN :
0-87942-568-7
DOI :
10.1109/ICPADM.1991.172094
