Title :
Functionally integrated systems on a chip: technologies, architectures, CAD tools, and applications
Author :
McShane, Erik A. ; Shenai, Krishna
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
Abstract :
The most important challenge in developing next-generation electronics is producing devices that exceed today´s performance levels while achieving ultra low-power efficiency and smaller package dimensions. The enabling technology is the evolution of digital, analog, and radio-frequency (RF) integrated circuits toward a monolithic implementation as a system on a chip (SOC). Applications range from consumer electronics like portable computing and mobile wireless communications, to aerospace and military for mobile intelligence systems and low-power satellites in scientific missions. Designs of this complexity require significant advanced in semiconductor technology to address the needs of diverse system components and ensure high-yield manufacturing. Systems will leverage conventional architectures, but the functional integration will also foster the development of novel circuit topologies. Finally, time-to-market demands motivate the emergence of a virtual wafer fab in which products can be designed, modeled, and simulated for validation before actual fabrication
Keywords :
circuit CAD; integrated circuit design; integrated circuit technology; technological forecasting; enabling technology; functional integration; low-power efficiency; next-generation electronics; novel circuit topologies; smaller package; system on a chip; virtual wafer fab; Analog integrated circuits; Digital integrated circuits; Electronics packaging; Integrated circuit packaging; Integrated circuit technology; Military computing; Mobile computing; Monolithic integrated circuits; Radio frequency; Radiofrequency integrated circuits;
Conference_Titel :
Innovative Architecture for Future Generation High-Performance Processors and Systems, 1997
Conference_Location :
Maui, HI
Print_ISBN :
0-8186-8424-0
DOI :
10.1109/IWIA.1997.670410