• DocumentCode
    2794374
  • Title

    DC-45 GHz Interconnections With New Flexgulide Technology

  • Author

    Pedersen, N.V. ; Norregaard, J. ; Johansen, E.

  • Author_Institution
    Tele Danmark Research, Danmark
  • fYear
    1995
  • fDate
    7-9 Aug. 1995
  • Firstpage
    7
  • Lastpage
    8
  • Abstract
    At frequencies above a few GHs, conventional interconnection techniques such as wire bonding and tape automated bonding (TAB) no longer meet the requirements for low loss transmission. We present a novel method for high-frequency interconnection of semiconductor devices using flexible waveguides - ´flexguides´. A special technique enables direct bonding of the flexguides without the use of flying leads. Simulations and measurements show excellent performance with an insertion loss of less than 0.8 dB in the frequency range from DC to 45 GHs.
  • Keywords
    Bonding; Coplanar waveguides; Frequency; Gallium arsenide; Integrated circuit interconnections; Metallization; Microstrip; Packaging; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Flat Panel Display Technology/Technologies for a Global Information Infrastructure/ICs for New Age Lightwave Communications/RF Optoelectronics, 1995 Digest of the LEOS Summer Topical Meetings
  • Conference_Location
    Keystone, CO, USA
  • Print_ISBN
    0-7803-2448-X
  • Type

    conf

  • DOI
    10.1109/LEOSST.1995.764137
  • Filename
    764137