DocumentCode
2794374
Title
DC-45 GHz Interconnections With New Flexgulide Technology
Author
Pedersen, N.V. ; Norregaard, J. ; Johansen, E.
Author_Institution
Tele Danmark Research, Danmark
fYear
1995
fDate
7-9 Aug. 1995
Firstpage
7
Lastpage
8
Abstract
At frequencies above a few GHs, conventional interconnection techniques such as wire bonding and tape automated bonding (TAB) no longer meet the requirements for low loss transmission. We present a novel method for high-frequency interconnection of semiconductor devices using flexible waveguides - ´flexguides´. A special technique enables direct bonding of the flexguides without the use of flying leads. Simulations and measurements show excellent performance with an insertion loss of less than 0.8 dB in the frequency range from DC to 45 GHs.
Keywords
Bonding; Coplanar waveguides; Frequency; Gallium arsenide; Integrated circuit interconnections; Metallization; Microstrip; Packaging; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Flat Panel Display Technology/Technologies for a Global Information Infrastructure/ICs for New Age Lightwave Communications/RF Optoelectronics, 1995 Digest of the LEOS Summer Topical Meetings
Conference_Location
Keystone, CO, USA
Print_ISBN
0-7803-2448-X
Type
conf
DOI
10.1109/LEOSST.1995.764137
Filename
764137
Link To Document