Title :
DC-45 GHz Interconnections With New Flexgulide Technology
Author :
Pedersen, N.V. ; Norregaard, J. ; Johansen, E.
Author_Institution :
Tele Danmark Research, Danmark
Abstract :
At frequencies above a few GHs, conventional interconnection techniques such as wire bonding and tape automated bonding (TAB) no longer meet the requirements for low loss transmission. We present a novel method for high-frequency interconnection of semiconductor devices using flexible waveguides - ´flexguides´. A special technique enables direct bonding of the flexguides without the use of flying leads. Simulations and measurements show excellent performance with an insertion loss of less than 0.8 dB in the frequency range from DC to 45 GHs.
Keywords :
Bonding; Coplanar waveguides; Frequency; Gallium arsenide; Integrated circuit interconnections; Metallization; Microstrip; Packaging; Substrates;
Conference_Titel :
Flat Panel Display Technology/Technologies for a Global Information Infrastructure/ICs for New Age Lightwave Communications/RF Optoelectronics, 1995 Digest of the LEOS Summer Topical Meetings
Conference_Location :
Keystone, CO, USA
Print_ISBN :
0-7803-2448-X
DOI :
10.1109/LEOSST.1995.764137
