• DocumentCode
    2794630
  • Title

    Design of high-temperature SiC three-phase AC-DC converter for >100°C ambient temperature

  • Author

    Wang, Ruxi ; Ning, Puqi ; Boroyevich, Dushan ; Danilovic, Milisav ; Wang, Fred ; Kaushik, Rajashekara

  • Author_Institution
    Center for Power Electron. Syst., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
  • fYear
    2010
  • fDate
    12-16 Sept. 2010
  • Firstpage
    1283
  • Lastpage
    1289
  • Abstract
    High temperature (HT) converters have become more and more important in industrial applications where the converters will operate in a harsh environment. These environments require the converter to have not only high-temperature semiconductor devices (SiC, GaN) but also high-temperature control electronics. This paper describes a design process for a three-phase PWM rectifier. The SiC JFET planar structure is used for the main semiconductor devices. Other high-temperature components, including the passive components, silicon-on-insulator chips and the auxiliary components are studied and summarized. Finally, a 1.4 kW lab prototype is fabricated and tested for verification.
  • Keywords
    AC-DC power convertors; PWM rectifiers; high-temperature electronics; junction gate field effect transistors; silicon compounds; silicon-on-insulator; wide band gap semiconductors; JFET; high temperature converters; high-temperature control electronics; high-temperature semiconductor devices; high-temperature three-phase AC-DC converter; passive components; power 1.4 kW; silicon-on-insulator chips; three-phase PWM rectifier; JFETs; Logic gates; Multichip modules; Silicon carbide; Silicon on insulator technology; Temperature sensors; Voltage control; High Temperature Converter; Silicon Carbide JFET; Silicon On Insulator Technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2010 IEEE
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    978-1-4244-5286-6
  • Electronic_ISBN
    978-1-4244-5287-3
  • Type

    conf

  • DOI
    10.1109/ECCE.2010.5617813
  • Filename
    5617813