DocumentCode
2795115
Title
Dielectric and thermoanalytical behaviors of moisture in aromatic polyamide paper
Author
Yasafuku, S. ; Todoki, Minoru
Author_Institution
Tokyo Denki Univ., Japan
fYear
1991
fDate
8-12 Jul 1991
Firstpage
804
Abstract
Specimens of an aromatic polyimide paper, Aramid paper, which were subjected to various degrees of moisture adsorption were investigated both dielectrically and thermoanalytically in order to estimate how much the adsorbed moisture affects the dielectric and thermoanalytical behaviors. It was clarified that, while in the humid specimens the dielectric properties did not change so much and there were no endothermic and exothermic peaks, in the soaked specimens the dielectric properties changed remarkably and there were large endothermic and exothermic peaks due to free water recognized at about 0°C. It was found that the dielectric properties of Aramid paper are rather stable to the moisture adsorption because its polyamide linkage bonds tightly with the adsorbed water, but when the adsorption reaches a value greater than the water content of 7.3%, a remarkable increase in the dielectric properties takes place because the free water is kept intact in the paper structure
Keywords
dielectric losses; dielectric properties of solids; permittivity; polymers; thermal analysis; Aramid paper; aromatic polyamide paper; dielectric properties; endothermic peaks; exothermic peaks; humid specimens; moisture adsorption; polyamide linkage; soaked specimens; thermoanalytical behaviors; water content; Chemicals; Couplings; Dielectric losses; Dielectric materials; Dielectric measurements; Dielectrics and electrical insulation; Moisture; Polyimides; Resistance heating; Water;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 1991., Proceedings of the 3rd International Conference on
Conference_Location
Tokyo
Print_ISBN
0-87942-568-7
Type
conf
DOI
10.1109/ICPADM.1991.172189
Filename
172189
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