Title :
Comprehensive optimization method for thermal properties and parasitics in power modules
Author :
Mühlfeld, Ole ; Fuchs, Friedrich W.
Author_Institution :
Christian-Albrechts-Univ. of Kiel, Kiel, Germany
Abstract :
A combined optimization approach regarding thermal properties and parasitic elements inside power semiconductor modules for power electronic converters is presented. The proposed method allows the determination of the best suited semiconductor positions on the DBC substrate as well as optimization of the substrate structure. The optimization procedure leads to a matrix representation illustrating the results in a concrete way.
Keywords :
DC-AC power convertors; modules; optimisation; power semiconductor devices; thermal properties; DBC substrate; combined optimization Method; direct bonded copper substrate; parasitic element; power electronic converter; power module; power semiconductor module; thermal property; Capacitance; Copper; Inductance; MOSFET circuits; Multichip modules; Optimization; Substrates; EMC/EMI; Packaging; Simulation; Thermal design;
Conference_Titel :
Energy Conversion Congress and Exposition (ECCE), 2010 IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
978-1-4244-5286-6
Electronic_ISBN :
978-1-4244-5287-3
DOI :
10.1109/ECCE.2010.5617848
