• DocumentCode
    2795458
  • Title

    TSC of oil/polymer film composite insulator with chemically etched polymer film

  • Author

    Ochiai, S. ; Iwasaki, H. ; Ieda, M. ; Mizutani, T.

  • Author_Institution
    Dept. of Electr. Eng., Aichi Inst. of Technol., Toyota, Japan
  • fYear
    1991
  • fDate
    8-12 Jul 1991
  • Firstpage
    875
  • Abstract
    The electrical properties and oil/polymer interaction for an alkylbenzene/polypropylene (PP) composite insulator with chemically etched polymer (PPc) were investigated with the thermally stimulated current (TSC), surface roughness, and FT-IR (Fourier transform infrared) methods. The etched rough surface was obtained by the dissolution of the amorphous part of the PP surface in sulfuric acid. The TSC obtained on an oil/PPc specimen has four clear peaks. The comparison in TSC between oil/PP (virgin) and oil/PPc revealed that impurities in PP exist near the surface of PP and that PPc has shallower ion traps than PP. It is concluded that the wettability of the polymer surface was improved by the chemical etching. In other words, the chemical etching of the polymer surface produces an optimum polymer surface for the impregnation of oil
  • Keywords
    composite insulating materials; etching; insulating oils; organic insulating materials; polymers; spectrochemical analysis; surface topography; thermally stimulated currents; wetting; FTIR method; TSC; alkylbenzene/polypropylene; chemical etching; dissolution; electrical properties; impurities; ion traps; oil impregnation; oil/polymer film composite insulator; oil/polymer interaction; polymer surface wettability; surface roughness; thermally stimulated current; Chemicals; Dielectrics and electrical insulation; Etching; Fourier transforms; Oil insulation; Petroleum; Plastic insulation; Polymer films; Rough surfaces; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 1991., Proceedings of the 3rd International Conference on
  • Conference_Location
    Tokyo
  • Print_ISBN
    0-87942-568-7
  • Type

    conf

  • DOI
    10.1109/ICPADM.1991.172208
  • Filename
    172208