Placement for productibility and assembly: information requirements

Author

Watts, Jonathon D. ; Pecht, Michael G.

Author_Institution

CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA

fYear

1990

fDate

1-3 Oct 1990

Firstpage

340

Lastpage

349

Abstract

The information requirements of board-level electronics design and assembly processes are surveyed in an effort to identify and explain the importance of proper information utilization in electronics design. The information discussed is used to develop a methodology for placing microelectronic components on mixed-technology printed wiring boards as a function of component mix, component types, the number of sides of the printed wiring board to be populated, and the abilities of the production equipment. As part of this methodology, a decision tree for selecting the en masse soldering technologies to be employed in the production of a design is presented. Additionally, a hierarchy for selecting the board-level assembly process plan as justified by the technologies and techniques employed in its assembly is discussed

Keywords

assembling; printed circuit design; printed circuit manufacture; soldering; assembly; board-level electronics design; component mix; component types; decision tree; en masse soldering technologies; information requirements; information utilization; mixed-technology printed wiring boards; productibility; production equipment; Assembly; Costs; Decision trees; Design methodology; Manufacturing processes; Process design; Production equipment; Soldering; Surface-mount technology; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1990 Proceedings, Competitive Manufacturing for the Next Decade. IEMT Symposium, Ninth IEEE/CHMT International

Conference_Location

Washington, DC

Type

conf

DOI

10.1109/IEMT9.1990.115029

Filename

115029