• DocumentCode
    2795785
  • Title

    Yield-aware floorplanning

  • Author

    Wo, Zhaojun ; Koren, Israel ; Ciesielski, Maciej J.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
  • fYear
    2005
  • fDate
    30 Aug.-3 Sept. 2005
  • Firstpage
    247
  • Lastpage
    251
  • Abstract
    Yield is normally ignored during the floorplanning stage. Recently, it has been shown that floorplanning can affect the yield with the increased sizes of chips. With the "medium-area clustering" model, yield can be evaluated during the floorplanning stage. Therefore, it\´s straightforward to incorporate yield in modern floorplanners. However, conventional simulate-annealing (SA) based moves are only designed for the combination of the area and/or the wire length minimizations. In this paper, we proposed a heuristic scheme of "moves" directly targeting on the yield improvement. The experimental results show a great yield improvement with little penalty for the area and/or the total wire length.
  • Keywords
    circuit layout; circuit optimisation; simulated annealing; medium-area clustering model; simulate-annealing; wire length minimization; yield-aware floorplanning; Area measurement; Delay; Joining processes; Length measurement; Packaging; Semiconductor device measurement; Semiconductor device modeling; Shape; Wire; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Digital System Design, 2005. Proceedings. 8th Euromicro Conference on
  • Print_ISBN
    0-7695-2433-8
  • Type

    conf

  • DOI
    10.1109/DSD.2005.80
  • Filename
    1559811