DocumentCode
2795785
Title
Yield-aware floorplanning
Author
Wo, Zhaojun ; Koren, Israel ; Ciesielski, Maciej J.
Author_Institution
Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
fYear
2005
fDate
30 Aug.-3 Sept. 2005
Firstpage
247
Lastpage
251
Abstract
Yield is normally ignored during the floorplanning stage. Recently, it has been shown that floorplanning can affect the yield with the increased sizes of chips. With the "medium-area clustering" model, yield can be evaluated during the floorplanning stage. Therefore, it\´s straightforward to incorporate yield in modern floorplanners. However, conventional simulate-annealing (SA) based moves are only designed for the combination of the area and/or the wire length minimizations. In this paper, we proposed a heuristic scheme of "moves" directly targeting on the yield improvement. The experimental results show a great yield improvement with little penalty for the area and/or the total wire length.
Keywords
circuit layout; circuit optimisation; simulated annealing; medium-area clustering model; simulate-annealing; wire length minimization; yield-aware floorplanning; Area measurement; Delay; Joining processes; Length measurement; Packaging; Semiconductor device measurement; Semiconductor device modeling; Shape; Wire; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Digital System Design, 2005. Proceedings. 8th Euromicro Conference on
Print_ISBN
0-7695-2433-8
Type
conf
DOI
10.1109/DSD.2005.80
Filename
1559811
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