• DocumentCode
    2795876
  • Title

    Power quality impact on thermal behaviour and life expectancy of insulated cables

  • Author

    Pacheco, Claudio R. ; De Oliveira, José C. ; Vilaca, Anderson L A

  • Author_Institution
    Dept. of Electr. Eng., Fed. Univ. of Uberlandia, Uberlandia, MG, Brazil
  • Volume
    3
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    893
  • Abstract
    This paper deals with the thermal behaviour and life expectancy analysis of power insulated cables under nonideal supply conditions. The proposed methodology utilises classical IEC-287 electrical and thermal models and extends the approach to cope with mutual thermal interaction between phases as well as power quality degradation. This allows for independent three-phase representation and both thermal and electric equations are solved in a simultaneous way. This comprehensive manner of representing the phenomenon is then implemented into a time domain computer program. Computational studies are then performed to evaluate the cable temperature rise as well as the effect upon life reduction under nonideal supply conditions
  • Keywords
    electric breakdown; harmonic distortion; matrix algebra; power cable insulation; power engineering computing; power supply quality; power system harmonics; thermal analysis; time-domain analysis; IEC-287; cable temperature rise; computer simulation; electrical and thermal models; insulated power cables; life expectancy; life reduction; mutual thermal interaction; nonideal supply conditions; power quality degradation; power quality impact; thermal behaviour; thermal models; three-phase representation; time domain computer program; Cable insulation; Cables; Copper; Dielectric losses; Dielectrics and electrical insulation; Integrated circuit modeling; Power quality; Temperature; Thermal conductivity; Thermal engineering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Harmonics and Quality of Power, 2000. Proceedings. Ninth International Conference on
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-6499-6
  • Type

    conf

  • DOI
    10.1109/ICHQP.2000.896847
  • Filename
    896847