Resistance of BGA Contacts During Reliability Tests

Author

Wrona, Rafal ; Drozd, Zdzislaw

Author_Institution

Telecommun. Res. Inst., Warsaw

fYear

2007

fDate

9-13 May 2007

Firstpage

162

Lastpage

166

Abstract

This paper shows the latest results of lead-free BGA solder joints investigations performed in frame of GrenRoSE Project financed by EC. First part is devoted for resistance measurement of BGA256r (pitch 1.27) contacts. Resistance was measured during mechanical bending tests. Resistance of lead-free and lead-containing BGA contacts during reliability test and reliability of these contacts were compared. Second part is devoted for reliability assessment of solder joints of BGA packages, type CSP84 (pitch 0.5 mm), BGA100 (pitch 0.8 mm), BGA144 and BGA676 (pitch 1.0 mm), BGA272 (pitch 1.27 mm), lead-free and lead-containing. These packages were tested by thermal shocks according to IPC 9701A and EN 62137 and mechanical fatigue test by bending on mechanical stand.

Keywords

ball grid arrays; reliability; soldering; BGA256r; EN 62137; IPC 9701A; ball grid arrays; lead-containing BGA contact resistance; lead-free BGA contact resistance; lead-free BGA solder joint reliability assessment; mechanical bending test; mechanical fatigue test; reliability test; resistance measurement; thermal shock; Contact resistance; Electric shock; Electrical resistance measurement; Environmentally friendly manufacturing techniques; Lead; Mechanical variables measurement; Packaging; Performance evaluation; Soldering; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology, 30th International Spring Seminar on

Conference_Location

Cluj-Napoca

Print_ISBN

987-1-4244-1218-1

Electronic_ISBN

987-1-4244-1218-1

Type

conf

DOI

10.1109/ISSE.2007.4432840

Filename

4432840