• DocumentCode
    2796136
  • Title

    Tunnung PID control gains for micro piezo-stage in using grey relational analysis

  • Author

    Lin, J. ; Chiang, H. ; Lin, C.C.

  • Author_Institution
    Dept. of Mech. Eng., Ching Yun Univ., Jungli
  • Volume
    7
  • fYear
    2008
  • fDate
    12-15 July 2008
  • Firstpage
    3863
  • Lastpage
    3868
  • Abstract
    Due to the requirements of the nanometer resolution in displacement, high stiffness, and fast response, piezo-actuators are used often in high-precision positioning applications. However, the materials of the piezo-actuators are ferroelectric, they fundamentally exhibit hysteresis behavior in the response to an applied electric field. This research focuses on the controlling of the piezoelectric positioning stage. In order to study the sensitivity of tuning the PID parameters to achieve the desired performance, the grey relational analysis has been proposed. Therefore, by tuning the PID parameters, the proposed controller owns the capability in handling such uncertain information. The experimental results of the proposed grey relational methodology also show that it is technically and economically feasible to develop a low-cost, reliable, automatic, less time-consuming controller for piezoelectric positioning stage. Hence, the results of this proposed methodology can be practicable to various mechanical systems, such as positioning control subjected to external disturbances.
  • Keywords
    microactuators; piezoelectric actuators; position control; three-term control; PID control gains; grey relational analysis; micropiezo-stage; piezo-actuators; piezoelectric positioning stage; positioning control; Actuators; Automatic control; Ferroelectric materials; Hysteresis; Machine learning; Optical microscopy; Piezoelectric materials; Sliding mode control; Solid modeling; Three-term control; Grey theory; PID; Piezoelectric positioning stage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Machine Learning and Cybernetics, 2008 International Conference on
  • Conference_Location
    Kunming
  • Print_ISBN
    978-1-4244-2095-7
  • Electronic_ISBN
    978-1-4244-2096-4
  • Type

    conf

  • DOI
    10.1109/ICMLC.2008.4621078
  • Filename
    4621078