High Frequency Behavior of Microstrip Lines on Composite Photopolymer Substrate

Author

Blecha, Tomas ; Hamacek, Ales ; Reboun, Jan

Author_Institution

Univ. of West Bohemia in Pilsen, Pilsen

fYear

2007

fDate

9-13 May 2007

Firstpage

208

Lastpage

212

Abstract

Recent trends in PCB design are microvia technologies. Several manufacturing processes are used for microvia technologies. PhotoVia is the method where the photoimageable dielectric materials have to be used. This paper deals with high frequency behavior of microstrip lines created on special photodielectric substrates. Scattering parameters are possible to use to describe high frequency properties of microstrip lines. The results of scattering parameters measurement of microstrip lines on photodielectric substrates are compared with microstrip lines on FR-4 or ARLON ADxxxx substrates.

Keywords

S-parameters; microstrip lines; optical polymers; printed circuit manufacture; PCB design; composite photopolymer substrate; high frequency behavior; microstrip lines; microvia technologies; photodielectric substrates; photoimageable dielectric materials; scattering parameters; Ceramics; Dielectric materials; Dielectric measurements; Dielectric substrates; Distributed parameter circuits; Frequency; Integrated circuit interconnections; Microstrip; Reflection; Scattering parameters;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology, 30th International Spring Seminar on

Conference_Location

Cluj-Napoca

Print_ISBN

987-1-4244-1218-1

Electronic_ISBN

987-1-4244-1218-1

Type

conf

DOI

10.1109/ISSE.2007.4432849

Filename

4432849