Title :
High Frequency Behavior of Microstrip Lines on Composite Photopolymer Substrate
Author :
Blecha, Tomas ; Hamacek, Ales ; Reboun, Jan
Author_Institution :
Univ. of West Bohemia in Pilsen, Pilsen
Abstract :
Recent trends in PCB design are microvia technologies. Several manufacturing processes are used for microvia technologies. PhotoVia is the method where the photoimageable dielectric materials have to be used. This paper deals with high frequency behavior of microstrip lines created on special photodielectric substrates. Scattering parameters are possible to use to describe high frequency properties of microstrip lines. The results of scattering parameters measurement of microstrip lines on photodielectric substrates are compared with microstrip lines on FR-4 or ARLON ADxxxx substrates.
Keywords :
S-parameters; microstrip lines; optical polymers; printed circuit manufacture; PCB design; composite photopolymer substrate; high frequency behavior; microstrip lines; microvia technologies; photodielectric substrates; photoimageable dielectric materials; scattering parameters; Ceramics; Dielectric materials; Dielectric measurements; Dielectric substrates; Distributed parameter circuits; Frequency; Integrated circuit interconnections; Microstrip; Reflection; Scattering parameters;
Conference_Titel :
Electronics Technology, 30th International Spring Seminar on
Conference_Location :
Cluj-Napoca
Print_ISBN :
987-1-4244-1218-1
Electronic_ISBN :
987-1-4244-1218-1
DOI :
10.1109/ISSE.2007.4432849
