DocumentCode :
2796284
Title :
Evaluation of Schottky barrier parameters of Al Schottky contacts on platinum doped n-silicon
Author :
Prabket, Jirawat ; Itthikusaman, W. ; Poyai, Amporn
Author_Institution :
Sch. of Electron. Eng., King Mongkut´s Inst. of Technol. Ladkrabang, Bangkok, Thailand
fYear :
2012
fDate :
16-18 May 2012
Firstpage :
1
Lastpage :
4
Abstract :
The current-voltage (I-V) and capacitance-voltage (C-V) measurements of Aluminum (Al) Schottky contacts on undoped and platinum-doped NTD n-Silicon were carried out in the temperature range of 300-420 K. The I-V and C-V characteristics were used to extract the saturation current, the ideality factor and the Schottky barrier height of the diodes. These parameters were correlated to the defect levels generated by the Pt in silicon. The results show that the saturation current of Pt doped diode is reduced and the Schottky barrier height of the diode is higher than from that of the diodes fabricated on undoped silicon diodes. This high value of the Schottky barrier height shows that Pt in silicon creates donor levels in the energy gap that compensate electrons to reduce the conductivity of the material. Such the Pt doped diodes have been found to perform better as low loss rectifiers due to there have less leakage current than undoped devices.
Keywords :
Schottky barriers; aluminium; capacitance; leakage currents; platinum; silicon; Al-Si:Pt; Schottky barrier height; Schottky contact; capacitance-voltage measurement; current-voltage measurement; defect level; donor level; ideality factor; leakage current; platinum doped n-silicon; saturation current; temperature 300 K to 420 K; Capacitance-voltage characteristics; Schottky barriers; Schottky diodes; Silicon; Substrates; Temperature measurement; Al-Schottky Contact; Schottky barrier; deep level; platinum-doped NTD silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON), 2012 9th International Conference on
Conference_Location :
Phetchaburi
Print_ISBN :
978-1-4673-2026-9
Type :
conf
DOI :
10.1109/ECTICon.2012.6254227
Filename :
6254227
Link To Document :
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