DocumentCode
2796335
Title
Numerical analysis of dielectric breakdown in polypropylene film based on thermal and electronic composite breakdown model
Author
Fukuma, Masumi ; Nagao, Masayuki ; Kosaki, Masamitsu
Author_Institution
Dept. of Electr. Eng., Matsue Coll. of Technol., Japan
fYear
1991
fDate
8-12 Jul 1991
Firstpage
1052
Abstract
DC electrical breakdown of polypropylene film was studied experimentally and theoretically. The temperature region was divided into two regions, and qualitative analysis of experimental results suggested an electronic breakdown in the low-temperature region and a thermal process in the high-temperature region. A novel breakdown model was proposed by introducing the electronic-breakdown criterion with thickness dependence in the bulk into the thermal-breakdown process due to the transient conduction current. The model could successfully explain the breakdown characteristics, not only in the low temperature, but also in the high-temperature region. This model suggested that the electronic breakdown occurs by hetero space charge at the anode at about 100°C. Experimental results of charging and discharging currents and breakdown tests with different combinations of electrode metals at 100°C supported the prediction of this breakdown model
Keywords
electric breakdown of solids; organic insulating materials; polymer films; 100 degC; DC electrical breakdown; breakdown tests; discharging currents; electronic breakdown; electronic-breakdown criterion; experimental results; hetero space charge; high-temperature region; low-temperature region; model; numerical analysis; polypropylene; temperature region; thermal-breakdown process; thickness dependence; transient conduction current; Anodes; Dielectric breakdown; Electric breakdown; Electrodes; Numerical analysis; Predictive models; Space charge; Temperature; Testing; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 1991., Proceedings of the 3rd International Conference on
Conference_Location
Tokyo
Print_ISBN
0-87942-568-7
Type
conf
DOI
10.1109/ICPADM.1991.172255
Filename
172255
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