• DocumentCode
    2796974
  • Title

    Novel MEMS Piezoresistive Sensor Array Cell

  • Author

    Stavrov, Vladimir ; Tomerov, Emil ; Stavreva, Galina ; Tsenev, Valentin ; Philippov, Philip

  • Author_Institution
    Nano Toolshop Ltd., Botevgrad
  • fYear
    2007
  • fDate
    9-13 May 2007
  • Firstpage
    497
  • Lastpage
    500
  • Abstract
    The future of analytical methods based on micro-fabricated cantilever sensors is critically sensitive to parallel processing: some because of the increased throughput required, but others, because of the complexity of the value to analyze. Parallel functioning needs arrays with cantilevers having two additional properties, simultaneously: to be addressable and to be independently actuated. Fulfilling these two requirements together, causes substantial increasing of complexity of both: layout and manufacturing technology. In present paper we demonstrate a novel design of MEMS-cell solving upper dilemma. The cell consists of four integrated cantilevers, having a single piezo-resistor each and different resonance frequencies. Samples of e-NOSE piezoresistive sensor using micro cantilevers on n-type, <100> Silicon, have been fabricated applying combined dry and wet etching techniques. The cantilever dimensions were chosen to provide approx. 1.5 kHz resonance frequency gap between any two neighbor sensors. The integrated bimorph actuator is common for all four of them, which fit very well a particular application. The behavior of the new cell was studied and its optimization according to both: manufacturing technology and application criteria was discussed.
  • Keywords
    electronic noses; etching; microsensors; piezoresistive devices; sensor arrays; MEMS piezoresistive sensor; bimorph actuator; dry etching techniques; e-NOSE; microfabricated cantilever sensors; parallel processing; piezo-resistor; sensor array cell; wet etching techniques; Manufacturing; Micromechanical devices; Parallel processing; Piezoresistance; Resonance; Resonant frequency; Sensor arrays; Silicon; Throughput; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 30th International Spring Seminar on
  • Conference_Location
    Cluj-Napoca
  • Print_ISBN
    987-1-4244-1218-1
  • Electronic_ISBN
    987-1-4244-1218-1
  • Type

    conf

  • DOI
    10.1109/ISSE.2007.4432907
  • Filename
    4432907