Roadmap of Lead-free Soldering

In this presentation is profiled in short form roadmap of Lead-free soldering process, which has a general character and sums the most important parameters and factors that concern achievements of good solder joint quality. This course is involved in the 5th semester of the Bachelor study program as well in extended form in Master Study program at Brno University of Technology but it has a general force for electrical engineering education. Curriculum is intended as well as an orientation for companies planning to go lead-free. Results assume many articles and works presented by IMAPS, IEEE and NEMI, as well some projects (ELFNET), journals (SMT, SMT&Packaging) and companies presentation (ERSA). The curriculum is targeted to the general population of electrical engineering students and industry part time students as well as all technicians working in microelectronics assembly technology sector. The course presents the concepts of the complete area of lead free soldering, that means includes mostly part of factors and parameters that might to affect the quality and reliability of solder joint.