• DocumentCode
    2797093
  • Title

    Disturbed bonding states in SiO/sub 2/ thin-films and their impact on time-dependent dielectric breakdown

  • Author

    McPherson, J.W. ; Mogul, H.C.

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    1998
  • fDate
    March 31 1998-April 2 1998
  • Firstpage
    47
  • Lastpage
    56
  • Abstract
    A temperature-independent field acceleration parameter /spl gamma/ and a field-independent activation energy /spl Delta/Ho can result when different types of disturbed bonding states are mixed during time-dependent dielectric breakdown (TDDB) testing of SiO/sub 2/ thin films. While /spl gamma/ for each defect type alone has the expected 1/T dependence and /spl Delta/Ho shows a linear decrease with electric field, a nearly temperature-independent /spl gamma/ and a field-independent /spl Delta/Ho can result when two or more disturbed bonding states are mixed. These observations suggest strongly that the oxygen vacancy is an important intrinsic defect for breakdown and that field, not current, is the cause of TDDB under low-field conditions.
  • Keywords
    bonds (chemical); dielectric thin films; electric breakdown; electric fields; failure analysis; integrated circuit reliability; integrated circuit testing; silicon compounds; vacancies (crystal); SiO/sub 2/; SiO/sub 2/ thin-films; TDDB testing; defect type; disturbed bonding state mixing; disturbed bonding states; electric field; field-independent activation energy; intrinsic breakdown defect; low-field conditions; oxygen vacancy; temperature-independent field acceleration parameter; time-dependent dielectric breakdown; time-dependent dielectric breakdown testing; Acceleration; Amorphous materials; Bonding; Dielectric thin films; Equations; Predictive models; Solids; Testing; Thermal degradation; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 1998. 36th Annual. 1998 IEEE International
  • Conference_Location
    Reno, NV, USA
  • Print_ISBN
    0-7803-4400-6
  • Type

    conf

  • DOI
    10.1109/RELPHY.1998.670441
  • Filename
    670441