• DocumentCode
    2797307
  • Title

    Mechanical characterization of silicon nitride thin-films using microtensile specimens with integrated 2D diffraction gratings

  • Author

    Gaspar, J. ; Nurcahyo, Y. ; Ruther, P. ; Paul, O.

  • Author_Institution
    Univ. of Freiburg, Freiburg
  • fYear
    2007
  • fDate
    21-25 Jan. 2007
  • Firstpage
    223
  • Lastpage
    226
  • Abstract
    This paper reports on the mechanical characterization of microtensile specimens made of silicon nitride (SiNx) thin-films with integrated 2D reflective gratings. By applying an axial force, the structures respond mechanically with an elongation and contraction in the longitudinal and transversal directions, respectively. The corresponding variations of both periods of the grating are monitored in real time by measuring the diffraction pattern resulting from the illumination of the grating with monochromatic light. The strain components are thus evaluated locally in the structure. By integrating such an optical technique with an efficient test structure previously developed, the extraction of materials´ Young´s modulus E, Poisson´s ratio nu, residual strain epsivres and stress sigmares and fracture strength sigma0 is in principle made possible from the measurement of a single test structure. Here we demonstrate the extraction of E, epsivres, sigmares and sigma0 of the nitride films.
  • Keywords
    Poisson ratio; Young´s modulus; diffraction gratings; fracture toughness; integrated optics; internal stresses; silicon compounds; tensile testing; thin films; Poisson ratio; Si3N4; Young´s modulus; axial force; diffraction pattern; fracture strength; integrated 2D diffraction gratings; integrated 2D reflective gratings; mechanical characterization; microtensile specimens; monochromatic light; residual strain; residual stress; silicon nitride thin-films; Capacitive sensors; Diffraction gratings; Integrated optics; Lighting; Materials testing; Monitoring; Optical diffraction; Semiconductor thin films; Silicon compounds; Strain measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on
  • Conference_Location
    Hyogo
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-095-5
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2007.4432964
  • Filename
    4432964