DocumentCode :
2797455
Title :
Biodegradable polymer needle with various tip angles and effect of vibration and surface tension on easy insertion
Author :
Aoyagi, S. ; Izumi, H. ; Fukuda, M.
Author_Institution :
Kansai Univ., Suita
fYear :
2007
fDate :
21-25 Jan. 2007
Firstpage :
397
Lastpage :
400
Abstract :
This paper proposes a fabrication method of microneedles with various tip angles made of biodegradable polymer (polylactic acid, referred to herein as PL A). It was confirmed by finite element method (FEM) simulation that stress concentration occurs more severely at the tip area, as the needle becomes thin, and tip angle becomes sharp. Masks for silicon cavities (negative dies for micromolding) with various tip angles are designed. The fabrication process involves etching a groove on the surface of a silicon die, molding the polymer into this groove, and then releasing it. The resistance force during inserting a fabricated needle to an artificial skin of silicone rubber was investigated. Effectiveness of sharp tip angle and thin shank for easy insertion is confirmed. Imitating mosquito´s needle, the effectiveness of vibrating needle, and giving surface tension to object surface was also confirmed.
Keywords :
bioMEMS; biodegradable materials; biomedical equipment; finite element analysis; masks; needles; polymers; silicon; silicone rubber; surface tension; vibrations; FEM; artificial skin; biodegradable polymer needle; finite element method; groove etching; masks; microneedle fabrication method; polylactic acid; silicon cavities; silicon die; silicone rubber; stress concentration; surface tension; vibration effect; Biodegradable materials; Etching; Fabrication; Finite element methods; Needles; Polymers; Silicon; Stress; Surface resistance; Surface tension;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on
Conference_Location :
Hyogo
ISSN :
1084-6999
Print_ISBN :
978-1-4244-095-5
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2007.4432974
Filename :
4432974
Link To Document :
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