• DocumentCode
    2797628
  • Title

    High-performance inclinometer with wide-angle measurement capability without damping effect

  • Author

    Lin, Che-Hsin ; Kuo, Shu-Ming

  • Author_Institution
    Nat. Sun Yat-Sen Univ., Tainan
  • fYear
    2007
  • fDate
    21-25 Jan. 2007
  • Firstpage
    585
  • Lastpage
    588
  • Abstract
    This paper reports a high-performance impedance-type inclinometer fabricated in a glass-SU-8-glass sandwich structure for wide angle and rapid angle response measurement. The output signal of the proposed inclinometer is reading from a movable metal pendulum based on the electrical potential measurement scheme. Two kinds of metal of Ga-In-Sn alloy and mercury are used as the pendulum mass of the inclinometer. The friction force between the liquid metal and substrate surfaces is dramatically reduced by applying the organic-based surfactant of SDS. Results show the proposed inclinometer has a very wide linear range of 320deg and a high angle resolution of 0.3deg (S/N=3). The measured results indicate that there is no time lag for the sensor output under the rotation speed of 1/8 RPS and also no damping effect for an instant stop from a rotation speed of 457s. The proposed inclinometer provides a simple yet high performance solution for tile angle measurement.
  • Keywords
    angular measurement; electric potential; electric sensing devices; gallium alloys; indium alloys; mercury (metal); pendulums; sandwich structures; surfactants; tin alloys; electrical potential measurement scheme; friction force; glass-SU-8-glass sandwich structure; high-performance inclinometer; impedance-type inclinometers; movable metal pendulum; organic-based surfactant; rapid angle response measurement; tile angle measurement; wide-angle measurement capability; Damping; Electric potential; Electric variables measurement; Friction; Goniometers; Impedance measurement; Rotation measurement; Sandwich structures; Time measurement; Velocity measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on
  • Conference_Location
    Hyogo
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-095-5
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2007.4432988
  • Filename
    4432988