Abstract :
The following topics are dealt with: temperature sensors; thermal data analysis; electro-thermal simulation; temperature mapping; advanced cooling techniques; thermal modelling; interconnects thermal performance; heat transfer enhancement; high temperature electronics; thermal software; heat transfer education; coupled effects; flow visualisation techniques; turbulence modelling; thermal stress; defect modelling; multiphysics simulation; nanotechnology applications; nanoengineering issues; noise control; power electronics; 3DIC; and thermal properties.
Keywords :
electronic engineering education; flow visualisation; heat transfer; high-temperature electronics; integrated circuit packaging; interconnections; interference suppression; nanotechnology; power electronics; temperature sensors; thermal stresses; three-dimensional integrated circuits; 3DIC; advanced cooling techniques; coupled effects; defect modelling; electro-thermal simulation; flow visualisation techniques; heat transfer education; heat transfer enhancement; high temperature electronics; interconnects thermal performance; multiphysics simulation; nanoengineering issues; nanotechnology applications; noise control; power electronics; temperature mapping; temperature sensors; thermal data analysis; thermal modelling; thermal properties; thermal software; thermal stress; turbulence modelling;
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on
Conference_Location :
Budapest
Print_ISBN :
978-1-4673-1882-2
