• DocumentCode
    2798085
  • Title

    Some technological and encapsulation issues of SAWS manufactured on langasite

  • Author

    Dumbravescu, N. ; Buiculescu, V.

  • Author_Institution
    IMT-Bucharest, Bucharest, Romania
  • Volume
    1
  • fYear
    2012
  • fDate
    15-17 Oct. 2012
  • Firstpage
    227
  • Lastpage
    230
  • Abstract
    This paper presents some aspects encountered in fabrication of surface acoustic wave (SAW) manufactured on langasite substrate. Results obtained after the first electrical test didn´t correspond to our expectations, although all devices passed through on optical inspection. It followed the de-capsulation of defective devices and the searching for failure causes. We detected several such mechanisms and after fixing them, we encapsulated and tested again the devices. Now, all devices were functioning properly. Comparative results of electrical test (before and after fixing the failure) are given.
  • Keywords
    encapsulation; surface acoustic wave devices; SAW; electrical test; encapsulation issues; fabrication; langasite substrate; surface acoustic wave; Metals; Optical surface waves; Ovens; Sputtering; Substrates; Surface acoustic wave devices; Surface acoustic waves; SAW; failure mechanism; langasite; technological and encapsulation issues;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference (CAS), 2012 International
  • Conference_Location
    Sinaia
  • ISSN
    1545-857X
  • Print_ISBN
    978-1-4673-0737-6
  • Type

    conf

  • DOI
    10.1109/SMICND.2012.6400646
  • Filename
    6400646