DocumentCode
2798085
Title
Some technological and encapsulation issues of SAWS manufactured on langasite
Author
Dumbravescu, N. ; Buiculescu, V.
Author_Institution
IMT-Bucharest, Bucharest, Romania
Volume
1
fYear
2012
fDate
15-17 Oct. 2012
Firstpage
227
Lastpage
230
Abstract
This paper presents some aspects encountered in fabrication of surface acoustic wave (SAW) manufactured on langasite substrate. Results obtained after the first electrical test didn´t correspond to our expectations, although all devices passed through on optical inspection. It followed the de-capsulation of defective devices and the searching for failure causes. We detected several such mechanisms and after fixing them, we encapsulated and tested again the devices. Now, all devices were functioning properly. Comparative results of electrical test (before and after fixing the failure) are given.
Keywords
encapsulation; surface acoustic wave devices; SAW; electrical test; encapsulation issues; fabrication; langasite substrate; surface acoustic wave; Metals; Optical surface waves; Ovens; Sputtering; Substrates; Surface acoustic wave devices; Surface acoustic waves; SAW; failure mechanism; langasite; technological and encapsulation issues;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference (CAS), 2012 International
Conference_Location
Sinaia
ISSN
1545-857X
Print_ISBN
978-1-4673-0737-6
Type
conf
DOI
10.1109/SMICND.2012.6400646
Filename
6400646
Link To Document