DocumentCode :
2798085
Title :
Some technological and encapsulation issues of SAWS manufactured on langasite
Author :
Dumbravescu, N. ; Buiculescu, V.
Author_Institution :
IMT-Bucharest, Bucharest, Romania
Volume :
1
fYear :
2012
fDate :
15-17 Oct. 2012
Firstpage :
227
Lastpage :
230
Abstract :
This paper presents some aspects encountered in fabrication of surface acoustic wave (SAW) manufactured on langasite substrate. Results obtained after the first electrical test didn´t correspond to our expectations, although all devices passed through on optical inspection. It followed the de-capsulation of defective devices and the searching for failure causes. We detected several such mechanisms and after fixing them, we encapsulated and tested again the devices. Now, all devices were functioning properly. Comparative results of electrical test (before and after fixing the failure) are given.
Keywords :
encapsulation; surface acoustic wave devices; SAW; electrical test; encapsulation issues; fabrication; langasite substrate; surface acoustic wave; Metals; Optical surface waves; Ovens; Sputtering; Substrates; Surface acoustic wave devices; Surface acoustic waves; SAW; failure mechanism; langasite; technological and encapsulation issues;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference (CAS), 2012 International
Conference_Location :
Sinaia
ISSN :
1545-857X
Print_ISBN :
978-1-4673-0737-6
Type :
conf
DOI :
10.1109/SMICND.2012.6400646
Filename :
6400646
Link To Document :
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